SOM-IMX8MM-OSM

The SoM-IMX8MM-OSM core board is an embedded System on Module developed according to the latest OSM (Open Standard Modules™) standard released by SGeT (Standardization Group for Embedded Technology eV). It adopts NXP’s iMX-8M-Mini processor with 2GB LPDDR4 and 8GB eMMC storage.LGA package design, without connectors, can be directly soldered on the functional carrier board, which is more stable. The design of OSM-L is adopted, which is small in size, low in power consumption, and has rich functional interfaces for expansion. It can be configured with suitable development boards according to actual applications. It can be flexibly used in related fields such as Industrial Internet of Things and AIoT.

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OSM standard

The SoM-IMX8MM-OSM is developed according to the latest OSM (Open Standard Modules™) standard released by SGeT (Standardization Group for Embedded Technology e.V) .

Small size, low cost embedded computer module

Bulid with 45*45mm “Size-L OSM” form factor.

Pre-tinned LGA package

Solder PCBs directly without connectors.

Open source design

Pre-defined Software and hardware interfaces.

Modular Embedded Computing

For a growing number of IoT applications, this standard helps to combine the advantages of modular embedded computing with increasing, requirements regarding costs, space and interfaces.

High Reliability

The SoM-IMX8MM-OSM equipped with an NXP i.MX 8M Mini processor, up to 8GB LPDDR4, 32GB eMMC flash or 512MB NAND flash.i.MX 8M Mini is NXP’s first embedded multi-core application processor built with advanced 14LPC FinFET process technology, which can provide higher speed and higher power efficiency. The i.MX 8M Mini series has commercial and industrial-level certifications, and is supported by NXP’s product life plan, and can be used in any general industrial and IoT applications.

Environmental Applicability

According to the actual use environment, there are industrial and commercial specifications to choose from: Industrial wide temperature version: -40~85 degrees; commercial version: 0~70 degrees.

SOM-IMX8MM-OSM

Abundant Application Interfaces

662 ball grid contact points, which can be expanded into a wealth of application interfaces.

SOM-IMX8MM-OSM

Flexible Carrier Design

It can be configured according to different product types and applications, and the product can be quickly customized.

SOM-IMX8MM-OSM

Flexible Carrier Design

It can be configured according to different product types and applications, and the product can be quickly customized.

Application Scenarios

Home audio/video systems, machine learning, vision, multimedia and industrial internet of things.

 

The Product Has a Long Life Cycle and can be Supplied for a Long Time

i.MX 8M Mini is included in the NXP product long-term supply plan, with a guaranteed supply period of at least 10 years, aiming to ensure stable product supply for your embedded design.

Other customized services + supplychain
Shell structure customization
Carrier board function customization
Provide SDK for secondarydevelopment
Mass production service
  • CHIPSET
    NXP iMX8M Mini
  • MARKET AREA
    Global
  • OS
    Yocto(Linux)/Android
  • CPU
    4xCortex-A53 core up to 1.8GHz per core
    1x Cortex-M4 core up to 400MHz
  • LPDDR4
    2GB(1G-8G optional)
  • EMMC FLASH
    8GB eMMC5.1(8-32GB Optional)
  • Ethernet
    *1 RGMII
  • SDIO
    *2
  • USB 2.0
    *2
  • UART
    *4 (UART4 –> Console)
  • I2C
    *4(I2C1–>PMU,I2C3–>MIPI CSI)
  • SAI
    *3 (SAI1 –> BOOT CFG)
  • SPI
    *1
  • SPDIF
    *1
  • JTAG
    *1
  • GPIO
    *16
  • PCIe
    *1
  • MIPI DSI
    *1
  • MIPI CSI
    *1 (4 lanes)

Mechanical properties

  • Power
    5V(PMIC:BD71847MWV)
  • Dimensions
    45*45mm(Size-L)
  • Wide working range
    Consumer (0°C to 70°C Tj)
    Industrial (-40°C to 85°C Tj)
  • RoHS and Reach compliant
    Yes


Carrier Board

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