DX-M1

DEEPX M.2 AI Accelerator

DEEPX M.2 AI Accelerator is a compact, high‑performance AI module that delivers exceptional inference accuracy, ultra‑low power operation, and a minimal spatial footprint. It maintains GPU‑level precision while consuming under 5W and operates reliably across an industrial temperature range of -25°C to 85°C.

  • High 25 TOPS INT8 AI performance (200 eTOPS)
  • Ultra-low power consumption of just 2W–5W
  • M.2 2280 form factor with PCIe Gen3 x4 interface
  • Onboard 4GB LPDDR5 memory and 1Gb NAND Flash
  • Supports TensorFlow, PyTorch, ONNX via DXNN® SDK
  • Compatible with x86 and ARM-based host systems
  • Ideal for edge cameras, robotics, drones, and smart factories

Vision-Optimized Edge AI

Integrating ISP and encoder, the DEEPX module enables end‑to‑end vision‑pipeline optimization under 7W, reducing CPU load for direct camera processing in security and retail.

Power Edge AI Performance

Featuring a dedicated AI accelerator integrated into a standard M.2 2280 form factor, this module delivers INT8 TOPS-class computing power, enabling high-performance inference in a compact design

Plug‑and‑Play Integration

With a universal PCIe M.2 interface supporting plug-and-play connectivity, the accelerator can be quickly embedded into existing x86/ARM-based devices, significantly lowering the hardware integration threshold and retrofitting costs.

Superior Power Efficiency

Designed with a high-efficiency architecture, the module achieves high inference throughput at just a few watts, leading in TOPS/Watt metrics and making it ideal for fanless and space-constrained edge environments.

Streamlined AI Deployment

A full suite SDK and toolchain—covering model compilation, optimization, and deployment—is provided, with support for mainstream AI frameworks, dramatically shortening the development cycle from model to product.

Processor INT8 Performance 25 TOPS (=200 eTOPS / INT8)
Signal Interface PCI Express PCIe Gen.3 x4 / Bandwidth: 4GB/s
Compatible to PCIE x1
Power Power Consumption 2W min., 5W max. for DEEPX supported models
Operating Temperature -25 ~ 85°C (Throttling)
-25 ~ 65°C (Non_Throttling)
Environment Humidity 40 °C @ 85% relative humidity (non-condensing)
Thermal Solution Cooling Heatsink (Option)
Physical Form Factor M.2 2280 (Key M)
Dimensions 22mm x 80mm x 4.1mm
Power Range 3.3V ± 5%
Software Support Windows Windows 11, 10 64 bit
Linux Ubuntu 22.04, 20.04 LTS
Support Yocto Project and Docker
Framework Support Support TensorFlow, TensorFlow Lite, ONNX, Keras, PyTorch by Dataflow compiler converted
System Support CPU Platform x86, ARM Based Architecture

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