Geniatech Expands SOM Portfolio with NXP i.MX95‑Based SMARC and OSM Modules to Drive Edge AI Innovation

January 13, 2026

Geniatech, a global leader in full-stack ARM embedded computing solutions, has officially released its new System-on-Module (SOM) series based on the NXP i.MX95 application processor. The lineup includes the OSM 1.1-compliant SOM-iMX95-OSM and the SMARC 2.1-compliant SOM-iMX95-SMARC. Designed for key markets such as smart retail, industrial automation, intelligent transportation, medical devices, and commercial IoT, the series combines multi-core performance, efficient AI inference, and industrial-grade reliability. Together with Geniatech’s long-term lifecycle commitment, these SOMs help customers shorten R&D cycles, secure their supply chains, and accelerate the deployment of next-generation edge intelligence products.

Core Technology Foundation: High Performance, Security, and Efficiency

Both i.MX95 SOMs are built around the NXP i.MX95 processor, featuring a 6-core Arm® Cortex®‑A55 cluster (up to 2.0 GHz) and dual real-time cores (Cortex‑M7 and Cortex‑M33) to achieve superior coordination between application processing and real-time control — ideal for industrial scenarios requiring both complex computation and precise responsiveness.

For AI workloads, the modules integrate NXP’s eIQ® Neutron NPU paired with the mature eIQ machine learning software environment, delivering powerful edge AI inference for vision analytics, predictive maintenance, and real-time data processing. Geniatech’s Energy Flex architecture ensures stable, sustained operation with typical power consumption of just 3 – 8 W.

In terms of multimedia and expansion, both modules include an advanced ISP, a 4K video codec engine, and an Arm Mali GPU for smooth graphics and multimedia performance. They support up to 16 GB LPDDR5 memory and 128 GB eMMC storage, along with interfaces such as MIPI‑CSI/DSI for diverse display needs. Connectivity options include USB 3.0, dual Gigabit Ethernet with TSN, PCIe Gen 3, and CAN‑FD, ensuring seamless integration across industrial and commercial environments.

Security is built in through NXP’s EdgeLock secure enclave and trusted execution environment, meeting ISO 26262 ASIL B and IEC 61508 SIL 2 standards. The modules support secure boot, encrypted storage, and OTA updates to ensure full lifecycle device protection.

Compact Reliability (OSM) vs. Flexible Scalability (SMARC)

SOM‑iMX95‑OSM: A compact solderable module designed for space-constrained edge devices
Compliant with the SGET OSM “Size L” standard (45 × 45 mm), this LGA solder-down module offers a cost-effective, rugged design ideal for harsh environments demanding miniaturization and reliability. Its connector‑less layout minimizes PCB space and BOM costs while improving mechanical strength and vibration resistance. Supporting –40 °C to +85 °C operation, it excels in industrial environments such as smart city sensors, portable medical devices, collaborative robots, and compact smart home appliances. Automated production capabilities further reduce manufacturing costs, enabling developers to embed high-performance AI into every size- and power‑constrained device.

SOM‑iMX95‑SMARC: A scalable industrial‑grade module for high‑performance edge computing
Based on the SGET SMARC 2.1 specification (82 × 50 mm), this variant delivers extensive I/O options and modular flexibility for demanding IoT and HMI applications. The edge connector design allows fast module swapping and upgrades, helping customers accelerate time‑to‑market and reduce product iteration costs.

With rich interface support and strong computing capability, the module is ideal for complex deployments such as multi‑display interactive terminals, AI inspection gateways, or edge servers handling high-speed network data. Like its OSM counterpart, it supports –40 °C to +85 °C operation and industrial‑grade reliability, forming a solid foundation for production‑ready industrial and commercial systems.

Full‑Stack Technology Support and Long‑Term Supply Commitment

With over 20 years of experience in ARM-based embedded systems, Geniatech offers far more than high-performance modules. Its full‑stack expertise covers custom carrier board design, low‑level driver optimization (including long‑term Linux Yocto Project support), and system integration — providing customers with end‑to‑end development and technical partnership services.

Each i.MX95 SOM comes with a complete board support package (BSP), pre‑verified drivers, ready‑to‑run images, and development kits, plus free design review services to help clients accelerate prototyping and evaluation.

Aligned with NXP’s 15‑year product longevity program, Geniatech ensures long‑term availability and supply chain stability for the i.MX95 SOM series — a critical advantage for industries such as industrial automation and medical technology that rely on extended lifecycle products.

Availability

Geniatech’s i.MX95 SMARC and OSM modules made their debut at CES 2026 and will be available for sampling in Q1 2026.
For more details, development kits, or custom design inquiries, please visit the Geniatech official website or contact a sales representative.

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